1 / 4 www.asb.co.kr j u l y 20 17 p lerow tm ALN2505AT internally matched lna module the plerow tm aln - series is the compactly designed surface - mount module for the use of the lna with or without the following gain blocks in the infrastructure equipment of the mobile wireless (cdma, gsm, pcs, phs, wcdma, dmb, wlan, wibro, wimax), gps, satellite commun i- cation terminals , catv and so on. it has an exceptional performance of low noise figure, high gain, high oip3, a nd low bias current. the stability factor is always kept more than unity over the application band in order to ensure its unconditionally stable implementation to the application system environment. the surface - mount module package including the completed matching circuit and other components necessary just in case allows very simple and convenient implementation onto the system board in mass production level. parameter unit specifications min typ max frequency range mhz 2300 2700 gain db 13 13.5 gain flatness db ? 0.7 ? 0.8 noise figure db 0.65 0.7 output ip3 (1) dbm 34 35 s11 / s22 (2) db - 12 / - 10 output p1db dbm 17 18 switching time (3) ? sec 1 supply current ma 65 75 supply voltage v 5 impedance ? 50 package type & size mm surface mount type, 10wx10lx3.8h operating temperature is - 40 ? c to +85 ? c. 1) oip3 is measured with two tones at an output power of 4 dbm / tone separated by 1 mhz. 2) s11/s22 (max) is the worst value within the frequency band. 3) switching time means the time that takes for output power to get stabilized to its final level after switching dc voltage fr om 0 v to v s . pin number function 2 rf in 5 rf out 6 v s other s ground feature s s 21 = 14.2 db @ 2300 mhz = 12.8 db @ 2700 mhz nf of 0.65 db over fr e quency unconditionally stable single 5v supply high oip3 @ low current note: 1. the number and size of ground via holes in a circuit board is criti cal for thermal rf grounding consider a tions. 2. we recommend that the ground via holes be placed on the bottom of all ground pins for better rf and thermal performance, as shown in the dra w ing at the left side. website: www.asb.co.kr e - mail: sales@asb.co.kr tel: (82) 42 - 528 - 722 3 f ax : (82) 42 - 528 - 7222 more inform a tion (recommended footprint) ALN2505AT asb inc. (top view) (bottom view) ? 0.4 plated thru holes to ground plane plerow (side view) 1 - stage single type description specifications (in pr o duction) typ. @ t = 25 ? c, v s = 5 v, freq. =2500 mhz, z o.sys = 50 ohm ou t line drawing (unit: mm) solder stencil area
2 / 4 www.asb.co.kr j u l y 20 17 p lerow tm ALN2505AT internally matched lna module s - param e ters noise figure oip3 p1db 2300~2700 mhz +5 v typical performance (measured) s - parameters & k fa c tor
3 / 4 www.asb.co.kr j u l y 20 17 p lerow tm ALN2505AT internally matched lna module 1. s - parameter 2. oip3, p1db & nf note: tested at room temperature. 1. s - parameter 2. oip3, p1db & nf note: tested at v s = 5 v . 2300 mhz 2500 mhz 2700 mhz s21 (db) s11 (db) s22 (db) s21 (db) g/f (db) s11 (db) s22 (db) s2 1 (db) s11 (db) s22 (db) 4.50 v 14.25 - 14.48 - 15.20 13.56 1.43 - 16.11 - 14.31 12.82 - 14.71 - 13.55 4.75 v 14.32 - 14.76 - 14.73 13.63 1.43 - 16.38 - 13.96 12.89 - 14.90 - 13.35 5.00 v 14.36 - 15.02 - 14.30 13.67 1.42 - 16.65 - 13.67 12.94 - 15.05 - 13.14 5.25 v 14.4 0 - 15.28 - 13.83 13.71 1.42 - 16.92 - 13.27 12.98 - 15.23 - 12.78 5.50 v 14.43 - 15.44 - 13.40 13.73 1.42 - 17.12 - 12.91 13.01 - 15.35 - 12.54 2300 mhz 2500 mhz 2700 mhz oip3 (dbm) p1db (dbm) nf (db) oip3 (dbm) p1db (dbm) nf ( db) oip3 (dbm) p1db (dbm) nf (db) 4.50 v 34.88 17.76 0.496 34.59 17.87 0.537 37.72 18.12 0.585 4.75 v 37.56 18.31 0.517 36.23 18.38 0.549 38.24 18.51 0.600 5.00 v 37.10 18.78 0.538 36.75 18.84 0.564 36.16 18.87 0.606 5.25 v 36.05 19.28 0.538 36.09 19.3 2 0.550 34.27 19.24 0.631 5.50 v 34.74 19.76 0.553 35.16 19.69 0.567 33.39 19.57 0.664 2300 mhz 2500 mhz 2700 mhz s21 (db) s11 (db) s22 (db) s21 (db) g/f (db) s11 (db) s22 (db) s21 (db) s11 (db) s22 (db) - 45 ? c 15.21 - 14.88 - 14.16 14.56 1.50 - 15.28 - 12.97 13.71 - 13.48 - 12.39 - 10 ? c 15.01 - 14.26 - 15.34 14.36 1.51 - 14.58 - 13.97 13.50 - 13.04 - 13.38 25 ? c 14.88 - 13.90 - 15.02 14.24 1.50 - 14.46 - 14.13 13.38 - 13.11 - 13.87 60 ? c 14.54 - 14.33 - 14.33 13.89 1.49 - 14.85 - 13.37 13.05 - 13.29 - 13.47 85 ? c 14.42 - 14.41 - 13.57 13.77 1.50 - 15.07 - 12.85 12.92 - 13.58 - 13.22 2300 mhz 2500 mhz 2700 mhz oip3 (dbm) p1db (dbm) nf (db) oip3 (dbm) p1db (dbm) nf (db) oip3 (dbm) p1db (dbm) nf (db) - 45 ? c 34.02 18.73 0.221 34.16 18.80 0.358 34.44 18.82 0.404 - 10 ? c 35.49 18.47 0.389 35.77 18.44 0.454 35.18 18.51 0.528 25 ? c 36.89 18.68 0.509 36.13 18.58 0.606 36.23 18.43 0.639 60 ? c 36.74 18.64 0.882 35.97 18.23 0.906 35.13 18.25 0.981 85 ? c 35.30 18.58 0.976 35.00 18.19 1.029 34.40 18.10 1.166 rf performance with operating temperature rf performance with voltage change
4 / 4 www.asb.co.kr j u l y 20 17 p lerow tm ALN2505AT internally matched lna module 1) the tantal or mlc (multi layer ceramic) capacitor is optional and for bypassing the ac noise introduced from the dc supply. the capacitance value may be determined by customer s dc supply status . the c a- pacitor should be placed as close as possible to v s pin and be connected directly to the ground plane for the best electrical performance . 2) dc blocking capacitors are always necessarily placed at the input and output port for allowing only the rf signal to pass and blocking the dc component in the signal. the dc blocking capacitors are inclu d- ed inside the aln module. therefore, c1 & c2 capacitors may not be necessary, but can be added just in case that the customer wan ts. the value of c1 & c2 is determined by considering the application fr e- quency. copyright ? 2008 - 2017 asb inc. all rights reserved. datasheet subject to change without notice. asb assumes no re- sponsibility for any errors which may appear in this datasheet. no part of the datasheet may be copied or reproduced in any form or by any means without the prior written consent of asb. application circuit recommended soldering reflow process 20~40 s ec 260 ? c 200 ? c 150 ? c 60~180 sec ramp - up (3 ? c/sec) ramp - down (6 ? c/sec) in out vs size 25x25mm (for aln - at, bt, t series C 10x10mm) + - aln out in c1 c2 v s tantal or mlc (multi layer c e ramic) c a pacitor evaluation board layout
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